SEMICONDUCTOR PHOTOLITHOGRAPHY TECHNOLOGY
CT Group is implementing the Photolithography Factory (FAB) project using GaN technology (III-V Compound group) – the first in Vietnam – specializing in the manufacture of special high-power chips ranging from W to kW; products are expected in 2028.
ASSEMBLY, PACKAGING, AND TESTING TECHNOLOGY
CT Semiconductor is building the first semiconductor assembly, packaging, and testing (ATP) factory mastered by Vietnamese technology, located at the CT Group High-Tech R&D Center on DT743, Binh Hoa Ward, Ho Chi Minh City (near Vietnam National University – Ho Chi Minh City).
Factory Capabilities:
- Semiconductor assembly and packaging (back-end stage)
- Final testing and ATE (Automated Test Equipment)
- Failure analysis and reliability testing
Advanced equipment systems ensuring high performance and superior quality
CT Semiconductor provides a wide range of ATP (Assembly, Testing & Packaging) services, including:
Lead-Frame based/Leaded ICs
PCB/ Substrate Base – SiP/BGA
Wafer Level – Chip Scale Package
CT Group strives to complete the entire semiconductor value chain in Vietnam, from design to final products, manufacturing a wide range of advanced chips, including those for security, and national security applications, thereby ensuring chip sovereignty for Vietnam.
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