CT Group is honored to announce the organization of the Semiconductor Advanced Packaging Forum: Vietnam’s Path Forward. The event is co-hosted by VNU-HCM and CT Group, featuring speakers who are experts and leaders from top enterprises in the semiconductor industry.
Forum Objectives:
- Discuss the development direction of the Outsourced Semiconductor Assembly and Test (OSAT) industry in Vietnam, learn from international models, and identify solutions that align with the local context.
- Provide in-depth knowledge on semiconductor packaging and testing technology, helping businesses and educational institutions stay updated with the latest trends.
- Foster collaboration between universities, businesses, and international experts to build a network that supports training, research, and technology transfer in the semiconductor sector.
Time & Venue:
- Date: March 14, 2025
- Venue: Tran Chi Dao Hall, VNU-HCM Administration Building
- Language: EnglishProgram Schedule
Opening Session Content Discussion Session: OPENING SESSION 08:30 – 09:40
- Introduction of the program and delegates – MC
- Opening speech – Chancellor of VNUHCM
- Speech – Ho Chi Minh City leadership representative
- Speech – Mr. Tran Kim Chung, Chairman of CT Group.
- Announcement of the Implementation Plan for Vietnam’s Semiconductor Industry Development Strategy and the Semiconductor Industry Workforce Development Program until 2030, with a Vision toward 2050, in Ho Chi Minh City. – Ho Chi Minh City representative.
- Introduction to the Program for Developing VNUHCM into a leading center for training, research, startups, and innovation in Semiconductor technology in Asia for the 2023-2030 Period, with a Vision toward 2045. – Ho Chi Minh City representative.
- Signing Ceremony of Cooperation Agreements
Session 1: POSITIONING VIETNAM’S SEMICONDUCTOR PACKAGING & TESTING INDUSTRY IN THE GLOBAL LANDSCAPE 09:40 – 12:30
- Keynote speech: A Retrospective Take on Talent Development:
- Vietnam’s Semiconductor Ambition – Mr. Andrew Goh, Corporate VP, LAM Research
- Presentation 1: OSAT Trend Worldwide and Vietnam’s geographic position – Mr. Nguyen Thanh Vinh, Former Vice President, ECI Technology
- Presentation 2: History of Semiconductor in Korea – Dr. Hwan Oh, President/CEO, Woowon Technology
- Presentation 3: Evolution of Packaging structures – Dr. Changhan Kim, Research Professor, Hanyang University
Lunch Break 12:30 – 13:30
Session 2: ADVANCED OSAT TECHNOLOGIES & APPLICATIONS13:30 – 17:30 - Presentation 4: Heterogenous Integration Packaging Technology for HPC (High Performance Computing) and AI – Dr. Jaedong Kim, Former Vice President, Amkor Technology
- Presentation 5: RDL, TSV, Bumping processes for Advanced Packaging – Mr. Cheeping Lee, Senior Director, LAM Research
- Presentation 6: AMR/AGV Operation with EES/MES Control for Semiconductor Packaging application – Mr. Jong Soo King, CEO, WiV
- Presentation 7: Chemicals used in OSAT environment – Mr. Daniel Cho, President, Spot
- Presentation 8: Recycling of Molding Compound Waste – Dr. Yamin Hsieh, CEO, Transcence
- Conclusion: Prof. Dr. Nguyen Thi Thanh Mai, Vice-Chancellor of VNUHCM
International Speakers:
The forum will feature leading experts in the semiconductor industry, including:
- Mr. Andrew Goh – Vice President, LAM Research
- Mr. Nguyen Thanh Vinh – Former Vice President, ECI Technology
- Dr. Hwan Oh – President & CEO, Woowon Technology
- Dr. Changhan Kim – Professor, Hanyang University
- Dr. Jaedong Kim – Former Vice President, Amkor
- Mr. Cheeping Lee – Senior Director, LAM Research
- Mr. Jong Soo Kim – CEO, WiV
- Mr. Daniel Cho – President, Spot
- Dr. Yamin Hsieh – CEO, Transcence
Registration
Students, faculty, researchers, and businesses interested in attending can register via this link:
Note: The registration link will close automatically once the maximum number of participants is reached.
For more information, please contact:
Department of External Relations & Project Development, VNUHCM
-
- Email: [hmtruong@vnuhcm.edu.vn]
- Phone: (+84-28) 37 242 181 (ext: 1452)
